Manufacturing:

Flexible, High tech PCB Assembly in featuring high mix, and high technology capable. We have a fully automatic Surface Mount process as well as complete Through Hole assembly capability.

Our SMT process features outstanding equipment from the leaders in our industry. We feature DEK stencil printing, Heller reflow, BGA X-Ray, and 2 Panasonic line with two placement machines. Each piece of equipment has been selected with specialized options that when combined as a complete process, sets us clearly apart from the competition.

We have designed our automated PCB assembly processes to allow for quick changeovers and flexibility as well as mid-high volume runs. We can handle BGA, CGA, 0402 chips, fine pitch components, as well as through hole, odd-form components and press-fit components and connectors. Our process is environmentally friendly using aqueous washable and no–clean chemistries. Special PCB Substrate Materials processing is no problem!

PCB ASSEMBLY CAPABILITIES BY PROCESS TYPE

SMT COMPONENT PLACEMENT: Panasonic equipment is known for flexibility, with two conveyorized in-line machines at our disposal we are able to react quick to client needs. Both SMT Lines features large board format capability, and both have high speed chip shooter placement rates. Both machines can run together with a combined maximum speed of over 10,000 components per hour. This process offers outstanding process control, as well as high speed. This configuration also allows flexibility to run both machines independently for prototypes, small lot sizes, and a high mix of jobs.

THROUGH HOLE COMPONENTS: We install all types of through hole components using several different methods. We have 1 computer controlled Universal 2596 that allow repeatable process controlled builds from 1 piece to 1000+. We also can use traditional progressive build slide-line style methodologies where appropriate for your PCB assembly.

REFLOW: We feature Heller Reflow ovens reflow oven184” process width, computer controlled process recipes, variable speed controlled cooling, and lead free capability. These machines was built to our custom configuration requirements by Heller.

WAVE SOLDER: We have 2 JT wave systems loaded with features. Rohs and non-Rohs applications and steady through put requirements mandate the use of two discreet systems. Our full size wave flows can gently solder the toughest PCB assembly!

CLEANING: Our processes are environmentally friendly. We use a combination of aqueous cleanable, and also no-clean chemistries in our process to provide a perfect solution for every application. Our Electrovert Aquastorm 200 closed-loop cleaner sports an optional Hurricane High Pressure Wash to insure products are squeaky clean and free from flux residues and ionic contamination.

Automated Inspection system: Our newly installed AOI F1 from Yield Enhancement Solutions. has significantly augmented our quality team and substantially supports our commitment to continual improvement. Every SMT assembly is subject to the scrutiny of our excellent team of source inspectors and is backed up by our AOI inspection team

BGA X-ray- Expanding technology require technology partners to keep pace and support customer needs. BGA technology and those new technologies to come require not only high quality placement systems but high quality verification tools as well. SAE has installed a Dage XD7600 X-ray system to insure that each BGA has been installed properly and we keep a photo library by serial number of every assembly.